Guangdong, China
Business Type:
Manufacturer/Factory & Trading Company
Main Products:
Year of Establishment:
2004-09-01
Registered Capital:
3.25 Million USD
Management System Certification:
ISO 9001, ISO 14001, ISO 14000, QC 080000
OEM/ODM Availability:
Yes
OEM/ODM Service
Sample Available

Solder Paste, Solder Wire, Solder Bar manufacturer / supplier in China, offering Snag3.0cu0.5 Soldering Tin Paste Mobile Phone Solder Paste BGA SMT, Lead Free Sn/Bi35/AG1.0 Rosin Core Solder Wire for Electrical Soldering Welding-Soldering-Supplies, High Quality Anti-Oxidation Welding Electrode Sn/AG1.0/Cu0.5 Lead-Free Tin Bar and so on.

Diamond Member Since 2018

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BGA solder ball

Total 35 BGA solder ball Products