| Customization: | Available |
|---|---|
| Type: | Solder Paste |
| Material: | Tin |
|
Still deciding? Get samples of $ !
Request Sample
|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
| Name | Lead-free solder paste |
| Alloy | Sn/Ag1.0/Cu0.5 |
| Package | 500g/bottle |
| Melting point | 217~227ºC |
| Particles | 25-45um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
The Sn/Ag1.0/Cu0.5 Lead-Free Solder Paste is an advanced formulation designed for high-performance electronic assembly applications requiring lead-free solutions. This solder paste comprises 1.0% silver (Ag) and 0.5% copper (Cu) in a tin (Sn) base, optimizing its mechanical strength and thermal conductivity.
The presence of silver enhances the joint strength and the ability to withstand thermal fatigue, making it suitable for high-density PCBs in consumer electronics and automotive applications. Its excellent wetting properties ensure reliable, clean solder joints with superior electrical connectivity.
Our company adheres to stringent quality control protocols to ensure that each batch of Sn/Ag1.0/Cu0.5 Lead-Free Solder Paste meets and exceeds industry standards. We are committed to providing products that not only meet but excel in reliability and performance expectations. Our solder paste is rigorously tested in state-of-the-art facilities to ensure consistent quality and performance.
Our product comes in environmentally friendly green cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wireSolder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
){kind=link}