Customization: | Available |
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Type: | Paste |
Material: | Tin |
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Alloy | Sn0.3Ag0.7Cu |
Package | 500g/bottle |
Melting point | 217-227ºC |
Particles | 25 - 45um(custom made) |
Viscosity | 190±20Pa.S |
Type | Ingredient (WT%) | Melting point (ºC) | Application scenario |
Lead paste | Sn63Pb37 | 183 | Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding |
Sn62.6Pb37Ag0.4 | 183-190 | ||
Sn60Pb40 | 183-203 | ||
Sn55Pb45 | 183-215 | Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding | |
Sn50Pb50 | 183-227 | ||
Sn45Pb55 | 183-238 | ||
Lead-free solder paste | Sn99Ag0.3Cu0.7 | 183-248 | Low cost, high melting point. Can be used for less demanding welding |
Sn96.5Ag3.0Cu0.5 | 183-258 | High cost, good performance, suitable for high-demand welding | |
Sn64.7Ag0.3Bi35 | 183-266 | Good performance, low melting point, and finer lattice alloys | |
Sn64Ag1.0Bi35 | 183-279 | High cost, good performance, commonly used lead-free solder | |
Sn42Bi58 | 227 | Prevent corrosion by CU, suitable for low temperature welding |