| Customization: | Available |
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| Type: | Solder Paste |
| Material: | Tin |
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| Name | Tin Lead solder paste |
| Alloy | SAC305 |
| Package | 100g |
| Melting point | 217ºC |
| Particles | 25-45um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
Technical parameters
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Alloy Composition
|
Sn96.5Ag3.0Cu0.5 |
Sn99Ag0.3Cu0.7 |
Sn42Bi58 |
Sn64Bi35Ag1 |
Sn63Pb37 |
|
Melting Point |
217°C |
219°C |
138°C |
139°C |
183°C |
|
Powder Specification |
25-45mm |
25-45mm |
25-45mm |
25-45mm |
20-38mm |
|
Flux Content |
9.0%-9.5% |
9.0%-9.5% |
9.0%-9.5% |
9.0%-9.5% |
9.0%-9.5% |
|
Viscosity |
190pa.s-210pa.s |
190pa.s-210pa.s |
190pa.s-210pa.s |
190pa.s-210pa.s |
190pa.s-210pa.s |
|
Solder ball Test |
Qualified |
Qualified |
Qualified |
Qualified |
Qualified |
|
Expansion Rate |
Qualified |
Qualified |
Qualified |
Qualified |
Qualified |
SAC305 Solder Paste is a high-performance, lead-free solder paste composed of 96.5% tin (Sn), 3.0% silver (Ag), and 0.5% copper (Cu). This alloy is renowned for its excellent soldering properties and mechanical strength, with a melting range between 217°C and 221°C (423°F and 430°F). It is specifically designed for surface mount technology (SMT), reflow soldering, and other demanding electronic assembly applications.
The addition of silver and copper enhances thermal and electrical conductivity, while also providing better mechanical strength and resistance to thermal fatigue. This ensures durable connections that can withstand the rigors of high-temperature cycling and mechanical stress.
SAC305 offers a balanced composition that optimizes performance and reliability in a wide range of applications.
Our product comes in white cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
Enhance your assembly efficiency with a paste that offers reduced voiding and strong, durable joints. Ideal for high-density PCBs, our solder paste maintains its integrity under rigorous conditions, ensuring that each application is precise and dependable.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wireSolder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
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