Customization: | Available |
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Metal Coating: | Tin |
Mode of Production: | SMT |
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Name | Lead-free solder paste |
Alloy | Sn-0.3AG-0.7cu-2bi-X |
Material | Tin |
Package | 500g/bottle |
Melting point | 211-224ºC |
Particles | 25 - 45um(custom made) |
Application scenario | Widely used in SMT industry. Suitable for smart phone, tablet computer, computer motherboard, computer peripheral, bluetooth headset, TV, monitor, etc |