In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder

Product Details
Customization: Available
Type: Flux-cored Wire
Material: Tin
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  • In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder
  • In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder
  • In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder
  • In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder
  • In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder
  • In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder
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  • Overview
  • Product Parameters
  • Applications
  • Product Features
  • Packaging & Shipping
  • Relate Products
  • Certifications
  • Company Exhibition
  • FAQ
Overview

Basic Info.

Model NO.
In51bi32.5sn16.5
Slag Characteristic
Acidic
Extended Length
<10mm
Application
LED, SMD
ODM
Yes
Color
Silver
Eutectic Temperature
60ºC
Customized Support
OEM, ODM, Obm
Packaging Details
10kg/Carton (Gross Weight) Pakage with Qanl Logo O
Transport Package
Zhongshi
Specification
customized
Trademark
Zhongshi/Customized
Origin
China
HS Code
3810100000
Production Capacity
6000 Tons

Packaging & Delivery

Package Size
37.00cm * 15.00cm * 6.80cm
Package Gross Weight
10.000kg

Product Description

Product Parameters
Name In solder Preforms
Ingredient In51Bi32.5Sn16.5
Diameter Custom made
Package Custom made
Eutectic Temperature 60ºC
Applications
 High-reliability applications including aerospace, medical devices, advanced electronics, and other critical soldering tasks
Product Features

In51Bi32.5Sn16.5 Solder Preform is engineered for high-performance soldering applications that require precise, reliable, and durable joints. The low melting point alloy composition makes it ideal for soldering heat-sensitive components and substrates, ensuring excellent wettability and mechanical strength.

Low Melting Point
Melts between 79ºC and 90ºC, perfect for heat-sensitive applications.

Enhanced Performance
Provides strong, durable joints with excellent thermal and electrical conductivity.

Superior Solder Flow
Ensures easy and efficient soldering with minimal bridging and excellent wetting properties.

In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform SolderPremium Indium, Bismuth, and Tin
Manufactured using high purity materials through a precise process.

Consistent Soldering Results
Prevents bridging and solder projection, forming a protective film to reduce oxidation and maintain bright solder spots.

Efficient Workflow
Designed to reduce soldering time and improve efficiency, meeting the demands of high-reliability applications.


 

Packaging & Shipping

We offer customization options to incorporate your own branding on the product.

Relate Products

Solder wireIn51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder
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Other solder products

In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder
Certifications

Our products have passed ROHS and REACH testing and certification. Each order can be accompanied by a batch of SGS certificate, material safety data sheet. The MSDS of this product can be obtained from our sales staff.
Our commitment to quality is backed by comprehensive customer support and technical assistance, ensuring your manufacturing processes run smoothly and efficiently.

In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder

 

Company Exhibition

In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform SolderIn51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder

FAQ

In51bi32.5sn16.5 Super Low Tenmurature Solder Ring Preform Solder

 

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