Snag3.0cu0.5 Soldering Tin Paste Mobile Phone Solder Paste BGA SMT

• Customization: Available
• Type: Solder Paste
• Material: Tin
• Model NO.: ROL0 Sn/Ag3.0/Cu0.5
• Flux Containing: Containing Flux
• Slag Characteristic: Acidic
• Extended Length: 10-20mm
• Package: 500g/Bottle
• Flux Content(%): 11.5±0.5
• Customized Support: OEM, ODM
• Melting Point: 217ºC
• Storage Temperature: 2~8ºC
• Application: BGA Soldering Paste
• Product Name: Soldering Solder Flux
• Transport Package: Customized
• Specification: 500g
• Trademark: customized/Zhongshi
• Origin: China
• HS Code: 3810100000
• Production Capacity: 6000 Tons
• Package Size: 34.00cm * 29.00cm * 22.50cm
• Package Gross Weight: 10.000kg

Product Description

Product Parameters

Name	Halogen free solder paste
Alloy	SnAg3Cu0.5
Package	500g/bottle
Melting point	217~220ºC
Particles	20-38um(custom made)
Viscosity	180±30Pa.S
Copper corrosion	Not happen

 

Detailed Photos

Packaging & Shipping

1.This product is packaged in pink cans.
2.The standard packaging weight of this product is 500 grams, which can be customized according to customer requirements.
3.Product information such as product model, alloy composition, product batch number, product weight, etc. is stuck on the can.
4.The solder paste label is also printed with brief usage precautions and safety and health precautions.
5.The registered trademark of our company is "ZS.HX Zhongshi".

Product Features

Features of Tin Lead Solder Paste Sn96.5Ag3Cu0.5 Halogen-Free:
The Sn96.5Ag3Cu0.5 Halogen-Free Solder Paste is engineered for superior performance in soldering, with a composition designed to provide excellent thermal and electrical conductivity. The absence of halogens reduces the risk of corrosion and decreases the environmental and health impact associated with more traditional solder pastes.

Our advanced formula offers exceptional thermal and electrical conductivity, ensuring your electronics perform optimally under all conditions.

With superior wetting properties and reduced voiding, our solder paste guarantees robust, reliable solder joints that are crucial for the long-term performance of your products. The inclusion of silver not only strengthens the joints but also enhances their durability, making this paste perfect for industries such as automotive and aerospace where reliability is critical.


Applications of Tin Lead Solder Paste Sn42Bi58 Halogen-Free:
Consumer Electronics: Perfect for assembling delicate electronics, such as smartphones, tablets, and wearables, where low-temperature soldering prevents component damage.
LED Lighting: Ideal for soldering temperature-sensitive LED components, ensuring their longevity and reliability without exposing them to high thermal stress.
Solar Panels: Suitable for connecting solar cell components, where low processing temperatures and environmental safety are crucial for both efficiency and durability.
Sensitive Electronic Assemblies: The paste's low melting point and halogen-free properties make it the solder of choice for medical devices, aerospace electronics, and other high-reliability applications requiring meticulous care during assembly.

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Certifications

Our products have passed ROHS and REACH testing and certification. Each order can be accompanied by a batch of SGS certificate, material safety data sheet. The MSDS of this product can be obtained from our sales staff.

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