| Type: | Solder Paste |
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| Material: | Tin |
| Flux Containing: | Containing Flux |
| Samples: |
Sn/Pb40-100g
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| Customization: |
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Shipping Cost:
Estimated freight per unit. |
about shipping cost and estimated delivery time. |
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| Payment Method: |
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| Initial Payment Full Payment |
| Currency: | US$ |
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| Return&refunds: | You can apply for a refund up to 30 days after receipt of the products. |
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Suppliers with verified business licenses
Audited Supplier | Name | Tin Lead solder paste |
| Alloy | Sn/Pb40 |
| Package | 500g/bottle |
| Melting point | 138ºC |
| Particles | 25-45um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
Sn/Pb40 Solder Paste, designed for those who value efficiency and reliability. Known for its excellent wetting properties and balanced melting point, this solder paste is perfect for a wide range of applications, from intricate electronics repair to general assembly tasks.
Whether you're a professional technician or a DIY enthusiast, our Sn/Pb40 provides the quality and reliability you need to tackle any project with confidence.
In an industry where the quality of your work hinges on the materials you use, our Sn/Pb40 Solder Paste stands out as a proven, cost-effective choice. It's ideal for those who need dependable results without the complications associated with some newer formulations
Our product comes in white cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
Enhance your assembly efficiency with a paste that offers reduced voiding and strong, durable joints. Ideal for high-density PCBs, our solder paste maintains its integrity under rigorous conditions, ensuring that each application is precise and dependable.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wireSolder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
Suppliers with verified business licenses
Audited Supplier 
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