| Customization: | Available |
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| Type: | Solder Paste |
| Material: | Tin |
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| Name | Tin Lead solder paste |
| Alloy | Sn63Pb37 |
| Package | 500g/bottle |
| Melting point | 183ºC |
| Particles | 25 - 38um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
| Type | Ingredient (WT%) | Melting point (ºC) | Application scenario |
| Lead paste | Sn63Pb37 | 183 | Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding |
| Sn62.6Pb37Ag0.4 | 183-190 | ||
| Sn60Pb40 | 183-203 | ||
| Sn55Pb45 | 183-215 | Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding | |
| Sn50Pb50 | 183-227 | ||
| Sn45Pb55 | 183-238 | ||
| Lead-free solder paste | Sn99Ag0.3Cu0.7 | 183-248 | Low cost, high melting point. Can be used for less demanding welding |
| Sn96.5Ag3.0Cu0.5 | 183-258 | High cost, good performance, suitable for high-demand welding | |
| Sn64.7Ag0.3Bi35 | 183-266 | Good performance, low melting point, and finer lattice alloys | |
| Sn64Ag1.0Bi35 | 183-279 | High cost, good performance, commonly used lead-free solder | |
| Sn42Bi58 | 227 | Prevent corrosion by CU, suitable for low temperature welding |
1.This product is packaged in white cans.
2.The standard packaging weight of this product is 500 grams, which can be customized according to customer requirements.
3.Product information such as product model, alloy composition, product batch number, product weight, etc. is stuck on the can.
4.The solder paste label is also printed with brief usage precautions and safety and health precautions.
5.The registered trademark of our company is "ZS.HX Zhongshi".
Superior storage stability
Place the canned solder paste in cold storage (5 ºC), placed at room temperature (25 ºC), 35 ºC thermostat placed, measuring viscosity every once in a while 25 ºC / 180 days, 35 ºC / 90 days, viscosity rise controlled within 10%.
Continuous printing stability
Use the same solder paste to print 8hr and measure the viscosity in steel net. After storage, print 8hr and measure the viscosity. Go on for the third day. No problem with viscosity after 3 days of continuous printing.
Lead-free solder wire
Tin-lead solder wireSolder bar
Our products have passed ROHS and REACH testing and certification. Each order can be accompanied by a batch of SGS certificate, material safety data sheet. The MSDS of this product can be obtained from our sales staff.
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