Lead-Free Pure Solder Bar Sn/Bi35/AG1.0 for Wave Soldering Machine PCB

• Type: L (Low Temperature Low Alloy Steel Electrode)
• Material: Tin
• Diameter: 1.6cm
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: Sn/Bi35-Ag1.0
• Length: 300-400mm
• Welding Core Type: Alloy Structural Steel
• Electrode Coating Type: Titanium Calcium
• Stainless Steel Welding Rod Type: Chromium Stainless Steel
• Function: Surfacing Electrode, Low Hydrogen Type Electrode, Hardfacing Electrode, High Efficient Iron Powder Electrode, Gravity Electrode, Moisture-Proof Electrode
• Welding Power: DC
• Melting Point(ºC): 138-178
• Density: 8.0g/cm3
• Customized Support: OEM, ODM
• Application: PCB, SMT, LED, High-Precision Products etc.
• Usages: Welding Tool
• Transport Package: Zhongshi(Customized)
• Specification: 33cm * 1.75cm * 1.2cm
• Trademark: Zhongshi(Customized)
• Origin: China
• HS Code: 8001202900
• Production Capacity: 6000 Tons
• Package Size: 38.00cm * 19.00cm * 11.00cm
• Package Gross Weight: 25.000kg

Product Description

Product Parameters

Name	Lead Free solder bar
Alloy composition	Sn/Bi35/Ag1.0
Package	25pcs/box,25kg/carton
Material	Sn,Pb
Melting point	227ºC
Product brand	ZhongShi/Customized
Soldering method	Manual dip tin & wave soldering tin
Use	Electronics assembly, repair work, and other soldering tasks requiring high reliability and strong, durable joints

 

Packaging & Shipping

Logo Specification:
Front: The company name "ZHONG SHI SOLDER" is displayed.
Box Label (50mm in length, 45mm in width): Utilized for traceability details such as alloy type, batch number, production date, weight, model, etc.
Right Side: Instructions for handling and storage conditions.
Weight: Net weight (25.0kg±50g) per box.
Our standard packaging consists of a double-layered box, with both an inner gift box featuring the Zhongshi Logo.
Customization with your logo is also available upon request.

Product Features

Sn/Bi35/Ag1.0 Solder Bar is designed for applications requiring low-temperature soldering and high reliability. The tin-bismuth-silver alloy composition offers excellent wettability and mechanical strength, making it suitable for a wide range of electronics and industrial applications.


Low Melting Point
Melts at 138ºC, ideal for heat-sensitive components and substrates.

Enhanced Performance
Provides strong, durable joints with excellent thermal and electrical conductivity.

Smooth Solder Flow
Ensures easy and efficient soldering with minimal bridging and excellent wetting properties.

Premium Tin, Bismuth, and Silver
Manufactured using high purity materials through a precise process.

Optimal Properties
Ensures high soldering speed, minimal residue, good wettability, and excellent thermal and electrical conductivity.

 

Relate Products

Lead Free Solder Wire
Tin Lead Solder Bar

Solder Paste
Other solder products

Company Profile

Our products have passed ROHS and REACH testing and certification. Each order can be accompanied by a batch of SGS certificate, material safety data sheet. The MSDS of this product can be obtained from our sales staff.

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