| Customization: | Available |
|---|---|
| Type: | L (Low Temperature Low Alloy Steel Electrode) |
| Material: | Tin |
|
Still deciding? Get samples of US$ 0.00/100G
Order Sample
|
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
|---|
| Payment Methods: |
|
|---|---|
| Support payments in USD |
| Secure payments: | Every payment you make on Made-in-China.com is protected by the platform. |
|---|
| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
|---|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
| Name | Lead Free solder bar |
| Alloy composition | Sn/Bi35/Ag1.0 |
| Package | 25pcs/box,25kg/carton |
| Material | Sn,Pb |
| Melting point | 227ºC |
| Product brand | ZhongShi/Customized |
| Soldering method | Manual dip tin & wave soldering tin |
| Use | Electronics assembly, repair work, and other soldering tasks requiring high reliability and strong, durable joints |
Logo Specification:
Front: The company name "ZHONG SHI SOLDER" is displayed.
Box Label (50mm in length, 45mm in width): Utilized for traceability details such as alloy type, batch number, production date, weight, model, etc.
Right Side: Instructions for handling and storage conditions.
Weight: Net weight (25.0kg±50g) per box.
Our standard packaging consists of a double-layered box, with both an inner gift box featuring the Zhongshi Logo.
Customization with your logo is also available upon request.
Sn/Bi35/Ag1.0 Solder Bar is designed for applications requiring low-temperature soldering and high reliability. The tin-bismuth-silver alloy composition offers excellent wettability and mechanical strength, making it suitable for a wide range of electronics and industrial applications.
Low Melting Point
Melts at 138ºC, ideal for heat-sensitive components and substrates.
Enhanced Performance
Provides strong, durable joints with excellent thermal and electrical conductivity.
Smooth Solder Flow
Ensures easy and efficient soldering with minimal bridging and excellent wetting properties.
Premium Tin, Bismuth, and Silver
Manufactured using high purity materials through a precise process.
Optimal Properties
Ensures high soldering speed, minimal residue, good wettability, and excellent thermal and electrical conductivity.
Lead Free Solder WireTin Lead Solder Bar
Solder PasteOther solder products
Our products have passed ROHS and REACH testing and certification. Each order can be accompanied by a batch of SGS certificate, material safety data sheet. The MSDS of this product can be obtained from our sales staff.
){kind=link}