| Customization: | Available |
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| Type: | Solder Paste |
| Material: | Tin |
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| Name | Tin Lead solder paste |
| Alloy | Sn57.5Pb42.5 |
| Package | 500g/bottle |
| Melting point | 183~195.5ºC |
| Particles | 25-45um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
Sn57.5Pb42.5 Tin Lead Solder Paste is a high-quality soldering material formulated for exceptional printability and reflow characteristics. The paste is engineered for fine pitch applications, providing excellent tackiness and minimal slump to maintain alignment on small pads.
The paste's refined composition ensures excellent wetting, reducing voiding and improving joint strength. This leads to fewer defects and lower rework rates, directly benefiting production efficiency. Its consistency and performance reliability help maintain throughput in high-volume assembly lines.
Choosing Sn57.5Pb42.5 Solder Paste aligns with values of precision, reliability, and efficiency. It demonstrates a commitment to quality and consistency, essential in sectors where the integrity of each solder joint can determine the overall performance of a high-stakes product.
Our product comes in white cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
Enhance your assembly efficiency with a paste that offers reduced voiding and strong, durable joints. Ideal for high-density PCBs, our solder paste maintains its integrity under rigorous conditions, ensuring that each application is precise and dependable.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wireSolder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
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