| Customization: | Available |
|---|---|
| Type: | Paste |
| Material: | Tin |
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The paste maintains its viscosity allowing for a high level continuous printing effect.
In addition, the flux contained in our Sn62.8Pb36.8Ag0.4 solder paste takes advantages of the high reliable low-ion type halogen activator.
After reflow soldering, it has less residue, high surface insulation resistance, stable and reliable electrical performance.
With nice fluidity and good soldering effect, the solder paste can accomplish the precision printing of circuit components, the separation distance of which can be only 0.2mm.
TECHNICAL DETAILS
Tin: 62.8%
Lead: 36.8%
Silver: 0.4%
Melting Point: 179°C ~ 189°C
TECHNICAL DETAILS
TECHNICAL DETAI
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