| Customization: | Available |
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| Type: | Solder Paste |
| Material: | Tin |
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| Name | Lead-free solder paste |
| Alloy | Sn96.5Ag3Cu0.5 |
| Package | 500g/bottle |
| Melting point | 217~220ºC |
| Particles | 25-38um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
High-Performance Alloy
The SAC305 solder bar, made from Sn96.5Ag3Cu0.5, is recognized for its superior performance in soldering applications. This alloy offers excellent mechanical strength and thermal fatigue resistance, making it ideal for high-reliability electronics that are subject to frequent thermal cycles.
Excellent Wetting Characteristics
SAC305 demonstrates exceptional wetting capabilities, which is critical for forming reliable solder joints. This property ensures that the solder spreads smoothly and evenly across the surfaces, creating stronger and more consistent connections.
Low Voiding
The formulation of SAC305 is optimized to reduce voiding in solder joints, a common issue that can compromise the integrity of electrical connections. Low voiding is especially important in high-density electronic applications where every connection counts.
Environmental Compliance
As a lead-free solder, SAC305 complies with global environmental regulations such as RoHS. Its use supports eco-friendly manufacturing practices by reducing hazardous substances in electronic assemblies and promoting safer and more sustainable production.
Thermal Stability
With a melting range typically around 217°C to 219°C, SAC305 provides good thermal stability, which is essential for processes involving sensitive components. This stability helps prevent damage during assembly and ensures reliability in the final product.
Our product comes in environmentally friendly green cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wireSolder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
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