No Clean Tin Lead Solder Wire Flux Cored High Quality

• Type: Flux-cored Wire
• Material: Tin
• Flux Containing: Containing Flux
• Slag Characteristic: Acidic
• Extended Length: <10mm
• Colour: Grey
• Model NO.: Sn45Pb55
• Package: 500g/Roll
• Export Port: Gz
• Application: LED, PCB, Precise Instruments
• Flux Content: 1.8%~4.0% for Optional
• Transport Package: Customized
• Specification: 0.2 / 3 mm
• Trademark: customized
• Origin: China
• HS Code: 831130000
• Production Capacity: 6000 Tons

Product Description

Basic Info

Model No: Sn45Pb55

Feature: No Clean, Bright Spot, No Splash and Smokeless

Trademark: ZhongShi

Transport Package: Spool

Origin:DongGuan, China

HS Code: 831130000

Product Description

Our Sn50Pb50 tin lead solid solder wire and solder bar possesses the melting point of approximately 200 degrees Celsius and the working temperature of 250 degrees Celsius. Sn50Pb50 means that the alloy of soldering wire consists of the 50% tin content and the 50% lead content. The diameter of our product varies from 0.2mm to 3.0mm. Formulated by utilizing high technology, the activated flux is used as the rosin flux in tin wire.
 

1. Features:

1. Satisfactory Solder Joint and Favorable Fluidity

Our solder joints are filled, bright and firm. Both RMA and RA cores are made in compliance with the IPC J-STD-006 and JIS Z 3283 Class AA/ Class A standards. All these solder fluxes can be dissolved in solvent, featuring very little smoke and very few splatters.

 

2. Flux Content%

For the vast majority of applications, the flux content is recommended to range from 1.8% to 4.0%.
The wire diameter is optional, including 0.2 to 3.5mm.

 

2. Specification:

 

No.	Item	SPEC
1	Components	Sn45Pb55
2	Flux Content %	2.2
3	Flux continuity	good fluidness
4	Halide Content (Wt%)	<0.5
5	Copper Plate Corrosion	Pass
6	Copper Mirror Corrosion	Pass
7	Insulated Resistance (Ω)	10 >1X10
8	Water-soluble resistors (Ω.cm)	10 >1X10
9	Extend rate %	>90
10	Residuum	Pass
11	Diameter (mm)	Φ0.2-3.0mm
12	Packing	10reel/carton, 10kg/carton

 

 

Components

Impurity Content %

Norm

Sn

Pb

Sb

Ag

Cu

Fe

Zn

Bi

Al

As

Ni

Cd

50±0.8

remnant

≤0.10%

≤0.02%

0.1%

≤0.02%

≤0.001%

≤0.10%

≤0.001%

≤0.03%

≤0.01%

<0.01%

Results

50.

remnant

0.032

0.0002

0.0057

0.002

0.0015

0.006

0.0024

0.0021

0.0032

0.0001