| Customization: | Available |
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| Type: | Solder Paste |
| Material: | Tin |
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At Zhongshi, we prioritize sustainability and product safety, with all our materials adhering to international certifications like ROHS and REACH. Our team of experts continuously collaborates with customers to provide tailored solutions for unique soldering challenges, ensuring efficient production processes and high-quality results. With a robust global supply chain and technical support team, we are equipped to handle orders of all sizes, offering timely delivery and after-sales service to clients worldwide.
| Name | Tin lead solder paste |
| Alloy | Sn63Pb37 |
| Package | 500g/bottle |
| Melting point | 183ºC |
| Particles | 25-45um(custom made) |
| Viscosity | 180±30Pa.S |
| Copper corrosion | Not happen |
Sn63Pb37 Solder Paste is designed for professionals who demand high performance and reliability in their soldering processes. With its eutectic alloy composition, this solder paste melts at a precise 183ºC, ensuring smooth, consistent soldering and strong, durable joints.
Ideal for applications requiring precise and efficient soldering, our Sn63Pb37 Solder Paste allows you to achieve professional results with ease. In an industry where material quality often dictates the success of a project, our Sn63Pb37 Solder Paste stands out by offering proven performance and reliability.
We are committed to providing products that not only meet but excel in reliability and performance expectations. Our solder paste is rigorously tested in state-of-the-art facilities to ensure consistent quality and performance.
Our product comes in environmentally friendly green cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wireSolder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.
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