Customization: | Available |
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Type: | Solder Paste |
Material: | Tin |
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Name | Tin lead solder paste |
Alloy | Sn10Pb88Ag2 |
Package | 500g/bottle |
Melting point | 278ºC |
Particles | 25-45um(custom made) |
Viscosity | 180±30Pa.S |
Copper corrosion | Not happen |
Sn10Pb88Ag2 Tin Lead Solder Paste is designed for professionals who demand high performance and reliability in their soldering processes. With its unique alloy composition, this solder paste offers exceptional mechanical strength, thermal stability, and excellent wettability, melting at 268ºC. The addition of silver enhances the conductivity and durability of the solder joints.
Ideal for applications requiring robust and reliable solder joints, our Sn10Pb88Ag2 Solder Paste ensures efficient and consistent results. In an industry where material quality often dictates the success of a project, our Sn10Pb88Ag2 Solder Paste stands out by offering proven performance and reliability.
We are committed to providing products that not only meet but excel in reliability and performance expectations. Our solder paste is rigorously tested in state-of-the-art facilities to ensure consistent quality and performance.
Our product comes in environmentally friendly green cans, with a default weight of 500 grams, customizable to meet specific customer needs. Each can is labeled with essential details including the product model, alloy composition, batch number, and weight. Additionally, the solder paste label provides concise instructions for use, along with safety and health guidelines. "ZS.HX Zhongshi" is the proud registered trademark of our company.
For enhanced storage stability, store the solder paste in a cool environment at 5 ºC. When kept at room temperature of 25 ºC or in a controlled setting of 35 ºC, monitor the viscosity periodically over 180 days at 25 ºC and 90 days at 35 ºC, ensuring the increase in viscosity remains below 10%.
Regarding continuous printing stability, maintain the same solder paste for 8 hours of printing and assess the viscosity using a steel net. Continue this process after storage and repeat for 3 consecutive days. Consistent viscosity is confirmed after three days of ongoing printing.
Lead-free solder wire
Tin-lead solder wireSolder bar
Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.