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| Customization: | Available |
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| Type: | Paste |
| Material: | Tin |
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| Alloy | Sn63/Pb37 |
| Package | 500g/bottle |
| Melting point | 183-203ºC |
| Particles | 25 - 45um(custom made) |
| Viscosity | 190±20Pa.S |
| Type | Ingredient (WT%) | Melting point (ºC) | Application scenario |
| Lead paste | Sn63Pb37 | 183 | Suitable for demanding circuit boards, such as: high-precision instruments, electronic industry, communications, micro-technology, aviation industry and other products welding |
| Sn62.6Pb37Ag0.4 | 183-190 | ||
| Sn60Pb40 | 183-203 | ||
| Sn55Pb45 | 183-215 | Applicable to the requirements of ordinary circuit boards, such as: home appliances, electrical instrumentation, automotive electronics, hardware and electrical appliances and other products welding | |
| Sn50Pb50 | 183-227 | ||
| Sn45Pb55 | 183-238 | ||
| Lead-free solder paste | Sn99Ag0.3Cu0.7 | 183-248 | Low cost, high melting point. Can be used for less demanding welding |
| Sn96.5Ag3.0Cu0.5 | 183-258 | High cost, good performance, suitable for high-demand welding | |
| Sn64.7Ag0.3Bi35 | 183-266 | Good performance, low melting point, and finer lattice alloys | |
| Sn64Ag1.0Bi35 | 183-279 | High cost, good performance, commonly used lead-free solder | |
| Sn42Bi58 | 227 | Prevent corrosion by CU, suitable for low temperature welding |



