Soldering Tin Paste Maintenance Chip Solder Paste BGA SMT LED Sn62.8AG0.4pb

• Type: Solder Paste
• Material: Tin
• Flux Containing: Containing Flux
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: Sn62.8Ag0.4Pb
• Slag Characteristic: Acidic
• Extended Length: 10-20mm
• Colour: Grey
• Package: 500g/Bottle
• Viscosity(PA·s): 180±30
• Packing: Jar
• Copper Corrosion: Not Happen
• Powder Size 2: Type 4: 20 to 38 Microns
• Application: BGA SMT LED
• Transport Package: Zhongshi
• Specification: 500g/customized
• Trademark: customized
• Origin: China
• HS Code: 3810100000
• Production Capacity: 6000 Tons
• Package Size: 34.00cm * 29.00cm * 22.50cm
• Package Gross Weight: 10.000kg

Product Description

Product Parameters

Name	Tin Lead solder paste
Alloy	Sn62.8Ag0.4Pb
Package	500g/bottle
Melting point	179~190ºC
Particles	25-45um(custom made)
Viscosity	180±30Pa.S
Copper corrosion	Not happen

Features of Tin Lead Solder Paste Sn62.8Ag0.4Pb:
Low Melting Point The solder paste Sn62.8Ag0.4Pb boasts a low melting point due to its specific alloy composition, facilitating easy reflow soldering processes.

This characteristic makes it particularly suitable for delicate electronic components that might be sensitive to high temperatures.Superior Wetting Ability This solder paste exhibits excellent wetting ability, allowing for quick and reliable solder joint formation.

The presence of silver (Ag) enhances the alloy's ability to spread over surfaces, ensuring strong, conductive connections with minimal voids.Enhanced Mechanical Strength The addition of a small amount of silver (Ag) to the traditional tin-lead (SnPb) solder improves the mechanical strength of the solder joints.

This enhancement is crucial for applications requiring robust physical connections, such as in mechanical assemblies or high-vibration environments.Eutectic Composition With a composition close to eutectic, Sn62.8Ag0.4Pb solder paste has a sharply defined melting point, which simplifies thermal profiling during soldering.
This property minimizes the risk of defects associated with the solidification process, such as cold joints or incomplete wetting.

Broad Application Range This solder paste is designed for a wide array of soldering applications, including surface-mount technology (SMT), through-hole, and mixed-technology PCB assemblies. Its formulation is optimized for both manual and automated soldering processes, making it a versatile choice for the electronics manufacturing industry.
 

 

 

Detailed Photos

Packaging & Shipping

Our product is packaged in eco-friendly green cans, each with a standard weight of 500 grams, though customization is available to accommodate unique customer requirements. Every can bears a label detailing the product model, alloy composition, batch number, and weight. The solder paste also comes with a label that offers clear instructions for use, as well as safety and health information. "ZS.HX Zhongshi" is our company's esteemed registered trademark.

 

Our Advantages

To ensure enhanced storage stability, the solder paste should be stored in a cool environment at 5 ºC. When stored at room temperature of 25 ºC or in a controlled environment of 35 ºC, it's important to periodically monitor the viscosity over 180 days at 25 ºC and over 90 days at 35 ºC, making sure the viscosity increase does not exceed 10%.
For continuous printing stability, use the same solder paste for 8 hours of printing and evaluate the viscosity with a steel net. This procedure should be continued after storage and repeated for three consecutive days. A consistent viscosity is verified after three days of continuous printing.

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Certifications

Our products are compliant with ROHS and REACH standards, having undergone rigorous testing and certification. With every order, we provide a corresponding SGS certificate along with a material safety data sheet. For further details on this product's MSDS, our sales team is available to assist you.

Company Exhibition

FAQ

Q1: Are you Manufacturer or Trading company?
A: We are a manufacturer with 20 years experience in the production of solder wire,solder bar,solder paste and many other solder materials.

Q2: How Do We Place an Order?
A:Please send Email or WeChat with us Via TM, MSN, Skype, and let us know your requirements on type, quantities. We will reply you with Proforma Invoice based on your order request. Kindly check the PI and If everything is OK, We will delivery the goods for you ASAP. After got your payment .

Q3:Do you accept OEM orders?
A:Yes, of course. But we have quantity requirement, pls feel free to contact our salesman for details.

Q4:What is your advantage?
A:Manufacturers for better prices, good quality and reputation, professional sales services.

Q5:Can you offer the free sample for testing?
A:Yes,we can offer free sample for testing, but the freight cost should be paid by customer side. 

Q6:How to store and How long is the warranty period?
A:Stored in a cool, dry, non-corrosive environment. Product warranty period of 1 year. 

Q7:What is your terms of payment?
A:T/T 30% as deposit, and 70% before delivery. We'll show you the photos of the products and packages.

Q8:What about the delivery time?
A:Usually 2-3 days for samples and 5-7 days for bulk orders. 

Q9:Can we visit your company/factory before place the order?
A:Yes. Welcome anytime.