| Customization: | Available |
|---|---|
| Type: | Flux-cored Wire |
| Material: | Tin |
|
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1. Features:
1. Fast Melting Speed, Superb Wettability and Terrific Expandability
The tin wire is added with the no-clean activated rosin flux, featuring fast melting speed, superb wettability and terrific expandability. Thereby, it can offer distinguished soldering effect.
2. Wonderful Electrical Conductivity, No Core Breakage, and No Splash.
3. High Melting Point
This Sn50Pb50 tin lead solid solder wire is formed by tin and lead. The leaded tin wire manufactured is characterized by high melting point, superb softness and nice wetting property.
2. Specification:
|
No. |
Item |
SPEC |
|
1 |
Components |
Sn63Pb37 |
|
2 |
Flux Content % |
2.0 |
|
3 |
Flux continuity |
good fluidness |
|
4 |
Halide Content (Wt%) |
<0.5 |
|
5 |
Copper Plate Corrosion |
Pass |
|
6 |
Copper Mirror Corrosion |
Pass |
|
7 |
Insulated Resistance (Ω) |
10 >1X10 |
|
8 |
Water-soluble resistors (Ω.cm) |
10 >1X10 |
|
9 |
Extend rate % |
>90 |
|
10 |
Residuum |
Pass |
|
11 |
Diameter (mm) |
Φ0.2-3.0mm |
|
12 |
Packing |
10reel/carton, 10kg/carton |
|
Components |
Impurity Content % |
|||||||||||
|
Norm |
Sn |
Pb |
Sb |
Ag |
Cu |
Fe |
Zn |
Bi |
Al |
As |
Ni |
Cd |
|
50±0.8 |
remnant |
≤0.10% |
≤0.02% |
0.1% |
≤0.02% |
≤0.001% |
≤0.10% |
≤0.001% |
≤0.03% |
≤0.01% |
<0.01% |
|
|
Results |
50. |
remnant |
0.032 |
0.0002 |
0.0057 |
0.002 |
0.0015 |
0.006 |
0.0024 |
0.0021 |
0.0032 |
0.0001 |
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